Next gen Intel chipsets to sport on-board Wi-Fi and USB 3.1
According to Taiwanese PC industry sources, Intel will be integrating both Wi-Fi and USB 3.1 components into its chipsets next year. It’s too near launch for this initiative to be applicable to the Intel 200-series motherboards, but the feature integration will be present in Intel 300-series motherboards “scheduled to be released at the end of 2017,” reports DigiTimes.
Motherboard makers speaking to DigiTimes said that Wi-Fi and USB interface chipmakers such as Broadcom, Realtek, and ASMedia could be adversely impacted by Intel’s decision. Hopefully such companies have a broad enough portfolio and were working on new developments, so the loss of Intel motherboard related business won’t be too painful. Even after the Intel move, some motherboards will still require more USB3.1 chips, for example, to equip more ports than the Intel ‘standard’. AMD could take up some slack if its Zen processors and motherboards become popular and it might also benefit from cheaper Wi-Fi and USB 3.1 components.
DigiTimes cites ASMedia’s predicament as being not-too-sticky. This particular firm will reportedly cater to increased demand for USB 3.1 device-side, and for related chips, and “10G signal redrivers and retimers”. Furthermore, ASMedia is known to be producing a high-speed transmission interface chipset for AMD motherboards.